Mold cleaning sheet and manufacturing method of a semiconductor device using the same

ABSTRACT

A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed along the peripheral edge to the outside of the plural cavities of the mating surface of the molding die, the cleaning sheet main body being formed with first through holes at positions corresponding to the cavities of the molding die, air vent slits and flow cavity recesses at positions corresponding to the air vents of the cavities, second through holes at positions corresponding to the pots of the molding die, and slits at positions corresponding to the runners of the molding die, thereby capable of improving the cleaning effect of the molding die and shortening the time for the cleaning operation to improve the productivity.

CROSS-REFERENCES

This is a continuation application of U.S. Ser. No. 11/218,603, filedSep. 6, 2005 (now U.S. Pat. No. 7,537,967), which is a continuationapplication of U.S. Ser. No. 10/763,187, filed Jan. 26, 2004, (nowabandoned) which is a continuation of U.S. Ser. No. 10/086,691, filedMar. 4, 2002 (now abandoned) which claim priority to JP 2001-149827,filed May 18, 2001 and JP 2001-213991, filed Jul. 13, 2001. Thisapplication is related to U.S. Ser. No. 11/417,110, filed May 4, 2006(now abandoned). The entire disclosures of the above-identifiedapplications are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

This invention concerns a semiconductor manufacturing technique and,more in particular, it relates to a technique effective to applicationfor the improvement of the cleaning effect for cleaning inside a moldingdie for use in semiconductor devices, as well as improvement for theproductivity.

The technique described below has been studied by the present inventorsupon study and completion of the invention and the outline is asdescribed below.

In the resin encapsulating step for resin encapsulation typesemiconductor devices, since resin molding steps are repeated again andagain, contaminants such as resin burrs, oxide films, oils or dusts areaccumulated to an inside of a molding die in which an encapsulatingresin is filled, that is, in the cavities and the runners, as well asthe periphery of air vents and cull blocks of an upper die and a lowerdie forming a pair of molding dies.

Since such contaminants give undesired effects on the quality of moldingand lower the releasability upon releasing of products from the moldingdie, an operator has to clean the molding die on every predeterminedcycles of resin shots.

However, since cleaning for the molding die by the operator, beingconducted by manual operation, requires a considerable period of time, atechnique capable of cleaning the molding die in a short period of timehas been demanded.

For coping with such a demand, Japanese Patent Laid-Open Hei 1(1989)-95010 discloses a cleaning method of clamping a lead frame notmounted with a semiconductor chip (hereinafter referred to as a dummylead frame) between main surfaces (mating surfaces) of a molding die andinjecting and hardening a cleaning resin formed, for example, of amelamine resin in the molding die, thereby depositing contaminants onthe surface of the cleaning resin and removing the contaminants togetherwith the cleaning resin.

Further, there is also a method of directly flowing a cleaning resin ata high pressure and a normal pressure into the cavity without using thedummy frame.

However, since an expensive dummy lead frame is used for cleaning inthis technique, it is not economical, and a high accuracy is necessaryfor positioning the molding die and the dummy lead frame since the dummylead frame of a predetermined shape adaptable to the molding die has tobe set and clamped at a predetermined position of the molding die.Further, the cleaning resin formed in the cull portions or the runnerportions are separated being detached from the lead frame and itrequires a considerable time to remove the separated resin from themolding die to worsen the operation efficiency. Further, the separatedculls and runners are put between the sliding portions of the moldingapparatus to sometimes result in disorder.

In view of the above, for overcoming such problems, the techniques to bedescribed below have also been proposed.

Japanese Patent Laid-Open Hei 6 (1994)-254866 discloses a methodcomprising the steps of clamping a sheet-like material made of a cottonfabric (non-woven fabric) capable of impregnating and permeating acleaning resin between opened molds, and filling a cleaning resin in amolten state into the cavity of closed molding dies.

As has been described above in the known literature, since a liquidcleaning resin is injected in a state where a sheet capable ofimpregnating and permeating a cleaning resin and a chemical is putbetween the main surfaces (mating surfaces) of upper and lower dies, thepositioning accuracy required between the molding die and sheet can belowered and the cleaning resin and the chemical penetrate also toportions where the sheet is put between the main surface of the upperand lower dies, thereby to conduct cleaning for the molding dies.

SUMMARY OF THE INVENTION

However, in the first mentioned technique, when the cleaning resin isfilled in the cavity, the sheet-like member moves vertically (lift) inthe cavity, by which the sheet-like member forms resistance to the flowof the cleaning resin to bring about a phenomenon that the cleaningresin does not prevail throughout the cavity.

As a result, this provides a problem that contaminants remain at thecorners of the cavity to make the cleaning for the inside of the cavityinsufficient.

The mating surface of the molding die is formed, at the corners of theouter periphery of the cavity, with concaved portions in communicationtherewith such as flow cavity (for receiving escaping air orencapsulating resin to the flow cavity to avoid inclusion of air fromthe gate or improve the balance of fillage of the encapsulating resin inthe cavity) or air vents.

However, in the cleaning for the molding die by using the molding diecleaning sheet, the cleaning resin less goes around to the vicinity ofthe corners of the cavity and, as a result, the cleaning resin does notintrude into the flow cavity or air vent during cleaning and does notclean the flow cavity or air vent and, accordingly, this results in aproblem for the insufficiency in the filling of the encapsulating resinto the cavity upon molding of products after the cleaning.

Further, when the encapsulating resin less goes around to the vicinityof the corners for the cavity, the cleaning resin is not entangled tothe molding die cleaning sheet at portions corresponding to the vicinityof the corners for the cavity, so that the cleaning resin remains upondetaching the cleaning resin together with the molding die cleaningsheet from the mating surfaces of the molding die after the completionof the cleaning, to require much labour for the removal of the moldingdie cleaning sheet and the cleaning resin from the mating surfaces, andthis particularly results in a problem that the cleaning resin clogs inthe air vents of the upper and lower cavities in three directions exceptfor the gates.

Further, at the mating surface of a molding die for conducting moldingof an SOP (Small Outline Package) having an elongate encapsulationportion or QFN (Quad Flat Non-leaded Package) using a matrix frame, whenthe distance between the outer end of the cavity and the edge of themating surface is relatively short (for example, 10 mm or less), thecleaning resin leaked from the cavity goes beyond the molding diecleaning sheet upon cleaning of the molding die and deposits on thelateral surface in contiguous from the mating surface of the moldingdie.

In such a case, it takes a long time to remove the cleaning resindeposited on the lateral side of the molding die and, as a result, thisresults in a problem of lowering the efficiency of the cleaningoperation for the molding die.

Further, as described above, the cleaning method of adsorbing thecontaminants by the melamine resin results in a problem that thesufficient cleaning effect can not sometimes be obtained.

This invention intends to provide a molding die cleaning sheet forimproving the cleaning effect for the molding die and shortening thetime for the cleaning operation thereby improving the productivity, aswell as a method of a manufacturing a semiconductor device using thesame.

The foregoing and other objects, as well as novel features of thisinvention will become apparent by reading the descriptions of thespecification and the appended drawings.

The outline of the typical inventions among those disclosed in thepresent application are briefly explained below.

The molding die cleaning sheet according to this invention is disposedbetween a first mold and a second mold of a molding die and adapted toclean the molding die, and comprises: a cleaning sheet main body formedwith first through holes corresponding to the cavities of the moldingdie, recesses corresponding to the air vents at each corner of thecavities, second through holes corresponding to the pots of the moldingdie and slits corresponding to the runners of the molding die; and areinforcing member for supporting the cleaning sheet main body at theperipheral edge thereof.

A method of manufacturing a semiconductor device according to anotherinvention of the present application comprises the steps of:

providing the molding die cleaning sheet having a cleaning sheet mainbody formed with first through holes corresponding to the cavities ofthe molding die, recesses corresponding to the air vents at each cornerof the cavities and second through holes corresponding to the pots ofthe molding die, and a reinforcing member for supporting the cleaningsheet main body at the peripheral edge thereof; disposing the cleaningsheet main body over the entire mating surface of the molding die whilecorresponding the first through holes of the cleaning sheet main body tothe cavities, the recesses to the air vents and the second through holesto the pots respectively and clamping the cleaning sheet main body bythe first mold and the second mold; supplying a cleaning resin from thepots to the cavities and passing the cleaning resin through the secondand the first through holes of the cleaning sheet main body therebyfilling the resin in the cavities; and hardening the cleaning resin andthen releasing the cleaning resin and the cleaning sheet main body fromthe molding die.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing an example for the structure of atransfer molding apparatus for conducting molding by using a molding diecleaning sheet of Embodiment 1 according to this invention;

FIG. 2 is a fragmentary cross sectional view showing the structure of aresin molding section in the transfer molding apparatus shown in FIG. 1;

FIG. 3A and FIG. 3B are views showing an example for the structure of amolding die cleaning sheet of Embodiment 1 according to this invention,in which FIG. 3A is a plan view and FIG. 3B is a cross sectional viewtaken along line A-A in FIG. 3A;

FIG. 4 is a plan view showing an example of a state where a molding diecleaning sheet is disposed at the mating surface of a second mold of themolding die disposed in a resin molding section;

FIG. 5 is a fragmentary cross sectional view showing an example of astate for cleaning the inside of the molding die by using the moldingdie cleaning sheet shown in FIG. 3;

FIG. 6 is a perspective view partially in cross section of an examplefor the structure of a semiconductor device manufactured by a method ofmanufacturing a semiconductor device according to this invention;

FIG. 7 is a plan view showing an example for the structure of a moldingdie cleaning sheet of Embodiment 2 according to this invention;

FIG. 8 is an enlarged fragmentary plan view showing an example of astate where the molding die cleaning sheet shown in FIG. 7 is disposedon the mating surface of the molding die;

FIG. 9 is a plan view showing the structure for a molding die cleaningsheet as a modified example of the molding die cleaning sheet shown inFIG. 7;

FIG. 10A and FIG. 10B are views showing an example for the structure ofa molding die cleaning sheet of Embodiment 3 according to this inventionin which FIG. 10A is a plan view and FIG. 10B is a cross sectional viewtaken along line B-B in FIG. 10A;

FIG. 11 is a plan view showing an example of a state where the moldingdie cleaning sheet shown in FIG. 10 is disposed on the mating surface ofthe molding die;

FIG. 12 is an enlarged fragmentary cross sectional view along line C-Cshown in FIG. 11;

FIG. 13 is a perspective view showing an example for the structure of amolding die cleaning sheet of Embodiment 4 according to this invention;

FIG. 14A, FIG. 14B and FIG. 14C are views showing the constitution ofthe molding die cleaning sheet shown in FIG. 13, in which FIG. 14A is aperspective view of a reinforcing frame, FIG. 14B is a perspective viewof a cleaning sheet main body and FIG. 14C is an enlarged fragmentaryplan view showing a portion D in FIG. 14B in an enlarged scale;

FIG. 15 is an enlarged fragmentary perspective view showing thestructure for a molding die cleaning sheet main body as a modifiedexample of the molding die cleaning sheet shown in FIG. 13;

FIG. 16A, FIG. 16B and FIG. 16C are views showing the constitution of amolding die cleaning sheet as a modified example of the molding diecleaning sheet shown in FIG. 13, in which FIG. 16A is an outerperspective view of a cleaning sheet main body, FIG. 16B is an outerperspective view of a reinforcing member and FIG. 16C is an enlargedfragmentary cross sectional view for a portion E in FIG. 16B in anenlarged scale;

FIG. 17 is a perspective view showing an example for the structure of asecond die to be cleaned by the molding die cleaning sheet shown in FIG.16;

FIG. 18 is a view for the result of temperature measurement showing anexample of measured values for the surface temperature of an operator ina usual mold operation and an existent molding die cleaning operation;

FIG. 19 is a cross sectional view, by a imaginary line, for an exampleof a flowing state of a cleaning resin in a cavity upon cleaning for themold by using a molding die cleaning sheet according to this invention;

FIG. 20 is a plan view showing the structure of a molding die cleaningsheet as a modified example of Embodiment 1 according to this invention;

FIG. 21 is a plan view showing an example of a deposition state of acleaning resin to a sheet when conducting cleaning for the mold by usingthe molding die cleaning sheet shown in FIG. 20;

FIG. 22 is a plan view showing the structure of a molding die cleaningsheet as a modified example of Embodiment 1 according to this invention;and

FIG. 23 is a plan view showing the structure of a molding die cleaningsheet as a modified example of Embodiment 1 according to this invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the following descriptions for the preferred embodiments,explanations for identical or similar portions are not repeated unlessrequired.

Further, for the following preferred embodiments, explanation is to bemade while dividing them into plural sections or embodiments ifnecessary for the sake of convenience, but they are concerned with eachother unless otherwise specified and in such a relation that oneconstitute a partial or entire modification, details and explanatoryexplanation of the other.

Further in the following embodiments, when the number of elements(including numbers, numerical values, quantity and range) are to bementioned, they are not restricted to the specified number and may belarger or smaller than the specified numbers unless otherwise specifiedor apparently restricted to specified numbers.

Embodiments of the invention are to be explained in details withreference to the drawings. Throughout the drawings for explaining theembodiments, those having identical functions carry the same referencenumerals for which duplicate explanations are to be omitted.

Embodiment 1

FIG. 1 is a perspective view showing an example for the structure of atransfer molding apparatus for conducting molding by using a molding diecleaning sheet of Embodiment 1 according to this invention; FIG. 2 is afragmentary cross sectional view showing the structure of a resinmolding section in the transfer molding apparatus shown in FIG. 1; FIG.3A and FIG. 3B are views showing an example for the structure of amolding die cleaning sheet of Embodiment 1 according to this invention,in which FIG. 3A is a plan view and FIG. 3B is a cross sectional viewtaken along line A-A in FIG. 3A; FIG. 4 is a plan view showing anexample of a state where a molding die cleaning sheet is disposed at themating surface of a second mold of the molding die disposed in a resinmolding section; FIG. 5 is a fragmentary cross sectional view showing anexample of a state for cleaning the inside of the molding die by usingthe molding die cleaning sheet shown in FIG. 3; FIG. 6 is a perspectiveview partially in cross section of an example for the structure of asemiconductor device manufactured by a method of manufacturing asemiconductor according to this invention; FIG. 19 is a cross sectionalview, shown by a imaginary line, for one embodiment of a flowing stateof a cleaning resin in a cavity upon cleaning for the mold by using amolding die cleaning sheet according to this invention; FIG. 20 is aplan view showing the structure of a molding die cleaning sheet as amodified example of Embodiment 1 according to this invention; FIG. 21 isa plan view showing an example of a deposition state of a cleaning resinto a sheet when conducting cleaning for the mold by using the moldingdie cleaning sheet shown in FIG. 20; FIG. 22 is a plan view showing thestructure of a molding die cleaning sheet as a modified example ofEmbodiment 1 according to this invention; and FIG. 23 is a plan viewshowing the structure of a molding die cleaning sheet as a modifiedexample of Embodiment 1 according to this invention.

A transfer molding apparatus shown in FIG. 1 is a multi-pot type andused, for example, for resin-encapsulating a semiconductor chip 24 andinner leads 20 connected electrically with the semiconductor chip 24 asshown in FIG. 6.

The transfer molding apparatus includes a first mold 3 as an upper mold,a second mold 4 as a lower mold paired therewith, a resin moldingsection 5 having the first mold 3 and the second mold 4, a loader 1 forloading works (for example, lead frames after completion of die bondingand wire bonding) into the resin molding section 5 and an unloader 2 forunloading the works out of the resin molding section 5. In the transfermolding apparatus, a lead frame bonded with a semiconductor chip 24(refer to FIG. 6), is loaded from the loader 1 shown in FIG. 1 to theresin molding section 5 and the semiconductor chip 24 and the like areresin-encapsulated in the resin molding section 5. A QFP (Quad FlatPackage) 19 as a resin-encapsulated semiconductor device completed withresin molding is unloaded to and contained in the unloader 2.

Further, the resin molding section 5 shown in FIG. 2, are provided withcavities 6 each of a shape corresponding to an encapsulation portion 22of the QFP 19 shown in FIG. 6, culls 7, runners 8, pots 9, a plunger 10,ejector plates 11, 15, ejector pins 12, 16, gates 13 and air vents 14.

Further, as shown in FIG. 4, cavities 6 each of a predetermined shape asa first concave, to which the semiconductor chip 24 is disposed, areformed at plural positions on the mating surface 26 of the second mold 4of the molding die 28 (refer to FIG. 2) (the cavities 6 are formed alsoon the mating surface 26 of the first mold 3 in the same manner as inthe second mold 4).

Further, an encapsulating resin such as tablets is set at apredetermined position of the second mold 4, plural cylindrical pots 9each having a second concave part are penetrated, and the culls 7 aredisposed as shown in FIG. 2, corresponding to the pots 9 at therespective portions of the first mold 3.

Further, plural runners 8 with which the plural cavities 6 are made tocommunicate are branched and formed from the culls 7 such that the upperside of the pots 9 is closed by the cull 7 and the pots 9 communicatewith the plural cavities by way of the culls 7 and the runners 8 in astate where the first mold 3 and the second mold 4 are in intimatecontact with each other. An air vent 14 is formed to the outside of eachcavity 6 for releasing the air in the cavity 6 to the outside tocomplete the filling of the resin.

Then, a molding die cleaning sheet (hereinafter simply referred to as acleaning sheet) 17 of the Embodiment 1 shown in FIG. 3 is to beexplained.

The cleaning sheet 17 is disposed between the first mold 3 and thesecond mold 4 of the molding die 28 for cleaning the inside of themolding die 28 when molding for the semiconductor chip 24 is notconducted. When it is disposed between the first mold 3 and the secondmold 4, it entirely covers the mating surfaces (parting surfaces otherthan the cavities) 26 of the molding die 28 and formed with throughholes 17 a corresponding to the cavities 6 of the molding die 28.

The through hole 17 a formed in the cleaning sheet 17 of the Embodiment1 is formed substantially in the same shape as the opening 6 a of thecavity 6 (refer to FIG. 2).

That is, the through hole 17 a is formed to a square shape which issubstantially identical with or slightly smaller than that of theopening 6 a of the cavity 6 in the first mold 3 and the second mold 4.

Thus, only the cleaning sheet 17 is clamped by the first mold 3 and thesecond mold 4 upon cleaning and a cleaning resin 25 shown in FIG. 5 issupplied to the cavities 6 in this state. Then, the cleaning resin 25passes through the through holes 17 a of the cleaning sheet 17 in thecavities 6 and, as a result, the cleaning resin is filled in thecavities 6 and the cleaning resin 25 is filled throughout the cavities 6without lifting the cleaning sheet 17.

Accordingly, the inside of the cavity 6 can be cleaned completely.

Further, the cleaning sheet 17 of the Embodiment 1 has a size and ashape to entirely cover the mating surface 26 of the second mold 4 (alsoof the first mold 4) as shown in FIG. 4.

That is, the sheet is formed to such a size as guided by positioningwedges 18 disposed to the respective outer sides of the mating surface26 of the second mold 4 for positioning the upper and lower molds.Accordingly, the cleaning sheet 17 can be placed on the mating surface26 of the second mold 4, by merely placing the cleaning sheet 17corresponding to the positioning wedges 18 on respective sides withoutrequiring positioning at high accuracy with respect to the molding die28.

Further, the cleaning sheet 17 in the Embodiment 1 formed, for example,of 100% paper, cloth or non-woven fabric having heat resistance andflexibility, and it is preferably composed of 100% non-woven cottonfabric.

Further, the thickness of the cleaning sheet 17 is about 0.2 mm uponclamping the first mold 3 and second mold and about 0.6 mm beforeclamping them.

Further, the QFP 19 shown in FIG. 6 is an example of a semiconductordevice assembled by molding in the transfer molding apparatus shown inFIG. 1, and it includes bonding wires 21 for electrically connecting theelectrodes of the semiconductor chip 24 and inner leads 20 correspondingthereto, an encapsulation portion 22 formed by resin encapsulating thesemiconductor chip 24, the inner leads 20 and bonding wires 21, andplural outer leads 23 in connection with the inner leads 20 andprojecting externally from the encapsulation portion 22 as externalterminals, the respective outer leads 23 being formed each in a gullwing like shape.

A method of manufacturing a semiconductor device of the Embodiment 1 isto be explained.

The method of manufacturing the semiconductor device comprises a molding(resin-encapsulating) step for the semiconductor chip 24 using thetransfer molding apparatus shown in FIG. 1 and a cleaning step for theinside of the molding die 28 of the transfer molding apparatus by usingthe cleaning sheet 27 shown in FIG. 3.

At first, in the wire bonding step, the semiconductor chip 24 and theinner leads of the lead frame as a work are electrically connected byway of the bonding wires 21.

Subsequently, in the molding step, the semiconductor chip 24, the innerleads 20 connected electrically with the semiconductor chip 24 and,further, the bonding wires 21 are resin-encapsulated with anencapsulating resin by using the transfer molding apparatus shown inFIG. 1.

The resin-encapsulating (molding) step in the molding step of theEmbodiment 1 is to be explained.

At first, solid encapsulating resin (tablet) heated by a pre-heater isset over the plunger 10 shown in FIG. 2 and, subsequently, the leasframe in which the semiconductor chip 24 and the inner leads 20 arebonded is transported from the loader 1 to the resin molding section 5shown in FIG. 1.

In this state, the second mold 4 is approached to the first mold 3 toform a space including the cavity 6 between the first mold 3 and thesecond mold 4 that constitute the molding die 28. Subsequently, when theencapsulating resin in a molten state is pushed out by the plunger 10 tothe cull 7, the encapsulating resin flows through the runner 8 and thegate 13 into the cavity 6.

Further, the encapsulating resin filled in the cavity 6 is thermally setby heat and cure and, subsequently, the second mold 4 is moveddownwardly to conduct mold opening.

Successively, the ejector plate 15 is moved downwardly and the ejectorplate 11 is moved upwardly. Thus, ejector pins 12, 16 are protruded tocomplete mold opening and the resin encapsulated resin encapsulationtype QFP (semiconductor device) 19 is taken out. Since several hundredcycles of resin shots are repeated per one day for the resinencapsulation, resin burrs and oxide films, or contaminants such as oilsor dusts (deposits) are accumulated in the inside of the molding die 28in which the encapsulated resin is filled, that is, on the matingsurfaces between the first mold 3 and the second mold 4 (includingperiphery of the air vent 14, the cavity 6 and, further, the runner 8and the cull 7).

Accordingly, for removing the contaminants, it is necessary to apply acleaning step for the molding die 28 after the molding step.

Subsequently, cutting for the lead frame is conducted to the QFP 19 in acutting step thereby completing assembling for the QFP 19 as shown inFIG. 6.

Successively, the cleaning step (method of cleaning the molding die) inthe Embodiment 1 is to be explained.

At first, a cleaning sheet 17 which is formed of a non-woven fabric,covers the entire mating surface 26 of the molding die 28 and hasthrough holes 17 a corresponding to the cavities 6 of the molding die 28shown in FIG. 3 is provided.

Successively, the mold temperature in the molding die is set, forexample, to 170° C. to 180° C.

Subsequently, as shown in FIG. 4, the cleaning sheet 17 is placed overthe entire mating surface 26 with the through holes 17 a beingcorresponded to the cavities 6 and, in this state, the second mold 4 isapproached to the first mold 3.

The cleaning sheet 17 is put and clamped between the first mold 3 andthe second mold 4 by the approaching movement and, subsequently, thecleaning resin 25 is supplied to the cavities 6.

In this case, as shown in FIG. 5, the cleaning resin 25 is filled in thecavities 6 passing through the through holes 17 a of the cleaning sheet17 while prevailing throughout the inside of the cavities 6.

In this case, since a sheet capable of impregnating and permeating thecleaning resin 25 is used for the cleaning sheet 17, the cleaning resin25 penetrates also to the portion of the cleaning sheet 17 put betweenthe first mold 3 and the second mold 4 to provide a merit that themating surface for the portions other than the pots 9 and the air vents14 of the molding die 28 can also be cleaned simultaneously.

Successively, the cleaning resin 25 is hardened and, subsequently, thesecond mold 4 is moved downwardly to conduct mold opening by separatingthe first mold 3 and the second mold 4.

Further, the ejector plate 15 is moved downwardly and the ejector plate11 is moved upwardly. Thus, ejector pins 12 and 16 are projected tocomplete the mold opening.

Subsequently, the cleaning resin 25 and the cleaning sheet 17 arereleased from the molding die 26.

That is, the cleaning sheet 17 and the cleaning resin 25 resin molded onthe sheet are taken out.

Thus, the inside of the molding die 28 is cleaned.

In this case, since a sheet capable of impregnating and permeating thecleaning resin 25 is used as the cleaning sheet 17, the cleaning resin25 that penetrates into fine portions such as the inside of the airvents or at the periphery of the cavities 6 between the mating surfaces26 of the molding die 28 is also firmly entangled to the cleaning sheet17, so that it can be removed reliably without being left on the matingsurfaces 26 of the mold upon taking out the cleaning sheet 17.

This provides an outstanding effect, particularly, for removing burrs inplural air vents 14 present in the upper and lower molds.

After cleaning the inside of the molding die 28 by using the cleaningsheet 17 shown in FIG. 3, when operation (molding) is conducted again,the semiconductor chip 24 is disposed in the cavity 6 of the molding die28 and, subsequently, the encapsulating resin is supplied to the cavity6 and the semiconductor chip 24 is resin-encapsulated by the same methodas the molding method described previously.

In a case where no sufficient cleaning effect can be obtained byadsorption of contaminants by the melamine resin, it is necessary torepeat the cleaning step by several cycles in order to ensure thecleanness on the main surface (mating surface 26) of the molding die.However, repeating of identical steps is troublesome and, in addition,no desired cleanness can be obtained sometimes depending on the natureof contaminants even by repeating the cleaning steps again and again.

In order to solve such a problem, higher cleaning effect can be obtainedby adding hard particles (filler) to the cleaning resin 25. The fillerentrained by the flow of the resin upon injecting the cleaning resin 25collides against the surface of the molding die 28 and removes thecontaminants on the surface of the molding die 28 to provide thecleaning effect. Higher cleaning effect can be obtained when the fillermoves being entrained on the flow of the cleaning resin at a higherspeed. For the material of the filler, silica or the like isappropriate.

However, such a cleaning effect by the collision of the filler can notbe sufficient in a wide space such as in the opening 6 a of the cavity 6compared with that in a narrow portion in the flow channel of thecleaning resin 25 such as in the runner 8. This is attributable to thatthe flow rate of the cleaning resin 25 is lowered in a wide flow channelportion of the cleaning resin 25 even in a case where the cleaning resin25 injected at an identical speed.

Further, such a cleaning effect by the filler for the cavity 6 isworsened extremely when a cleaning sheet 17 not having the through holes17 at the portions corresponding to the openings 6 a of the cavities 6is used. This is because the flow resistance upon injection of thecleaning resin increases to lower the flow speed of the cleaning resin25 by the presence of the cleaning sheet 17 across the opening 6 a ofthe cavity 6.

Further, in a case where a soft cleaning sheet 17 such as made of anon-woven fabric is used, the cleaning sheet is sometimes localized tothe first mold 3 or the second mold 4 by the injection under pressure ofthe cleaning resin 25, to extremely narrow the space between the mainsurface of the mold and the cleaning sheet 17, and the flow resistanceis increased extremely at an extremely narrow space thus formed.

In the wide opening 6 a of the cavity 6, since the cleaning resin 25tends to pass through a flow channel at a lower flow resistance, theflow speed of the cleaning resin 25 is extremely lowered in the spacenarrowed by localization of the cleaning sheet 17 to the main surface ofthe mold, so that a desired cleaning effect by the collision of thefiller is no more obtainable.

Then, in this embodiment, by the use of the cleaning sheet 17 havingthrough holes 17 a at the portions corresponding to the openings 6 a ofthe cavities 6 and not having such a pattern as traversing the openings6 a, it is possible to decrease the flow resistance of the cleaningresin 25 in the openings 6 a and provide a higher cleaning effect by thecollision of the filler entrained by the turbulence of the cleaningresin 25 that has a high flowing speed and occurs at random as shown inFIG. 19.

When the filler is added to the cleaning resin 25, it is effective thatthe cleaning sheet 17 has a plurality of openings each having a diametergreater than that of the filler on one surface in order not todeteriorate the impregnating and permeating property for the cleaningresin 25.

Further, for lowering the flow resistance of the cleaning resin in thecavity 6, it is desirable that the through holes 17 a formed in thecleaning sheet 17 has such a pattern that the cleaning sheet 17 does nottraverse the inside of the cavity 6. However, the through holes 17 a maybe patterned such that the cleaning sheet 17 is disposed in the cavitiesso long as it is within such an extent as not remarkably increasing theflow resistance of the cleaning resin 25.

When it is intended to further enhance the cleaning effect by thefiller, it is effective to lower the flow resistance of the resin in theresin injection channel between the pot 9 and the cavity 6,particularly, at the portion of the gate 13 where the cross section ofthe resin injection channel is smallest. For this purpose, it isdesirable that the cleaning sheet has openings not only for the portionscorresponding to the cavities 6 but also for the portions correspondingto the gates 13. For example, as shown in FIG. 20, a frame-like cleaningsheet 36 having an opening 39 in a region including pots 9, runners 8,gates 13, cavities 6, air vents 14, flow cavities 27 and a portionbetween the mold mating surfaces 26 between the cavities may be used.

Further, the shape of the frame-like part preferably has a function ofnot leaking the cleaning resin 25 out of the opening 39 upon injectionof the cleaning resin 25.

There is no particular restriction on the material for the frame-likecleaning sheet 36 and the cost can be reduced by the use of materialsuch as paper. Further, in order to prevent the cleaning resin 25 fromleaking, it is desirable that the cleaning sheet 36 has such a frameshape as not having a gap (through hole or the like) larger than thediameter of the filler contained in the cleaning resin 25.

Further, since the cleaning sheet 36 is deformed flexibly in accordancewith unevenness of the mold by the use of paper having lower modulus ofelasticity compared, for example, with that of a Cu metal plate, leakageof the cleaning resin 25, for example, from the air vent portions can beprevented effectively also in the cleaning sheet 36 having a largeopening and having a narrow frame-like shape. Further, it is possible toprovide a general utilizability by using a flat cleaning sheet 36without changing the fine unevenness of the mold, for example, change ofthe positions for the air vents.

Further, as shown in FIG. 21, after the injection step of the cleaningresin 25, the hardened cleaning resin 25 is removed together with thecleaning sheet 36 from the portion between the molds. It is preferred inthis case to remove the cleaning resin 25 hardened between the matingsurfaces 26 of the molds in the regions of the pots 9, runners 8, gates13, cavities 6, air vents 14, flow cavities 27 and regions between thecavities in an integrated state in order to simplify the step ofremoving the cleaning resin 25.

However, when the strength of the resin hardened between the mold matingsurfaces 26 is insufficient, the hardened cleaning resin 25 broken anddisintegrated individually between the cavities 6 and 6, between the pot9 and the cavity 6 or in the portion between the cavity 6 and thecleaning sheet 36 when the molds are opened or when the hardenedcleaning resin 25 is removed from the mold.

In order to avoid the problem described above, it is necessary toincrease the strength of the resin hardened between the mold matingsurfaces 26. For this purpose, there is a method of increasing thethickness of the cleaning sheet 36 to thereby increase the thickness ofthe resin hardened between the mold mating surfaces 26. The thickness ofthe cleaning sheet 36 in this embodiment is, for example, 0.65 mm beforeputting between the molds and the thickness of the cleaning resin 25hardened between the mold mating surfaces 26 is about 0.3 mm.

The numerical values for the thickness of the cleaning sheet 36 or thecleaning resin 25 are examples and not restricted only thereto. In orderto keep the strength of the hardened cleaning resin 25, it is preferredthat the thickness of the cleaning resin 25 hardened in the opening 39even at the thinnest portion is preferably 1/10 or more of the resinhardened in the cavity.

Then, even when the thickness of the resin hardened between the moldmating surfaces 26 is controlled to 1/10 or more for the thickness ofthe cavity 6 as described above, in a case where the cull 7 is thickcompared with the cavity 6, the cleaning resin 25 may sometimes becracked due to the insufficient strength of the resin hardened betweenthe mold mating surfaces 26.

In order to avoid such a problem, as shown in FIG. 22, it is effectiveto use a cleaning sheet 38 having a reinforcement 37 at the periphery ofthe cull 7. The reinforcement 37 may be formed with paper integratedwith the frame part as shown in FIG. 22 but it may be also formed of anon-woven fabric as shown by the hatched region in FIG. 23.

In the cleaning sheet 36, since a resin injection speed can be obtainedto some extent even between the mold mating surfaces 26 in a regionbetween the cavity 6 and the cavity 6, improvement for the cleaningeffect due to friction with the filler can be expected compared with theprevious embodiment of disposing the cleaning sheet 36 between the moldmating surfaces 26. It is extremely effective in that the cleaningeffect can be expected by the filler over the entire peripheralcircumference of the cavity 6 severely contaminated particularly withthe sealing resin.

The material for the cleaning sheet in this Embodiment 1 is required tohave such a heat resistance as capable of enduring heat applied in thecleaning step. The temperature of heat applied to the cleaning step isabout 180° C. in this embodiment.

However, a usual binder, for example, an acrylic resin used for makingpaper has a low heat resistance and may bring about a problem such asdeformation of the cleaning sheet, adhesion to the molding die 28 orcontamination of the molding die 28 by the binder melted by the heat inthe cleaning step described to this embodiment.

In order to avoid such a problem, it is effective to use, for example, anon-woven fabric not using binder for the cleaning sheet, highly heatresistant material such as teflon, fluorine or polypropylene (PP)intended for heat resistant use as the binder, or to coat a cleaningsheet with a highly heat resistant material such as teflon or fluorine.

Further, a cleaning sheet coated at a frame with a mold releasing agentor impregnated at a frame with a releasing agent (oil, wax, etc.) isalso effective.

This Embodiment 1 has been explained for the shot operation of acleaning resin (melamine) 25 in the cleaning operation but it will beapparent that this is applicable also to the mold releasing recoveryoperation using a so-called releasing resin conducted after theoperation (operation of conducting 5 to 7 shots of melamine resin, 2shots of releasing recovery and two shots of product resin is referredto as cleaning operation)

According to the cleaning sheet for the molding die according toEmbodiment 1 and the manufacturing method for the semiconductor deviceusing the same, the following functions and effects can be obtained.

That is, since the cleaning resin 25 can pass the through holes 17 a ofthe cleaning sheet 17 upon supplying and filling the cleaning resin 25into the cavities 6 since the through holes 17 a are formedcorresponding in the cleaning sheet 17 corresponding to the cavities 6,the cleaning resin 25 can prevail throughout each cavity 6 withouthindering the flow of the cleaning resin 25 in the cavity 6 irrespectiveof the filler contained in the cleaning resin 25 or the resin injectionpressure.

As a result, contamination at the corners of the cavity 6 can also beremoved by the cleaning resin 25 prevailing throughout the cavity 6.

This can conduct cleaning for the cavity 6 of the molding die 28sufficiently and, accordingly, the cleaning effect can be improved.

Further, since the cleaning resin 25 formed by the cavities 6, themating surfaces 26 (parting surfaces), culls 7 and gates 13 are joinedby the cleaning sheet 17 that covers the entire mating surfaces 26 ofthe molding die 28 upon cleaning, when the cleaning sheet 17 is takenout after the hardening of the cleaning resin 25, it can be taken outintegrally on the cleaning sheet 17 without being broken individually.

Accordingly, attachment and detachment of the cleaning sheet 17 to andfrom the molding die 28 can be conducted easily, by which the cleaningsheet 17 can also be treated easily even after the cleaning.

As a result, the time for the cleaning operation using the cleaningsheet 17 can be shortened.

Further, since the cleaning sheet 17 covers the entire mating surfaces26 of the molding die 28, contamination can be removed at the inlet ofthe pot 9, at the periphery of the culls 7 and, further, in the airvents 14 of the molding die 28 by entangling the cleaning resin 25 tothe cleaning sheet 17 and, as a result, resin burrs can be removed andthe operation time can be shortened greatly.

Further, since the cleaning sheet 17 covers the entire mating surface 26of the molding die 28, it is also possible to clean portions in themolding die 28 that are not in contact with the cleaning resin 25.

Further, since the entire mating surfaces 26 of the molding die 28 arecovered by one cleaning sheet irrespective of the number of lead framesset in the molding die 28, positioning at high accuracy of the cleaningsheet 17 relative to the molding die 28 is no more required.

In this case, by the use of the cleaning sheet 17 formed of thenon-woven fabric as in this Embodiment 1, it is no more necessary forthe fabrication of positioning pins or fabrication of positioningpinholes relative to the molding die 28 as in the existent case of usingthe dummy lead frame.

Accordingly, the cost for the molding die 28 can be decreased.

Further, since the dummy lead frame is not used, deviated molding causedby the deviation of the dummy lead frame does not occur.

Further, since the mating surfaces 26 of the molding die 28 are entirelycovered with one cleaning sheet, it may suffice to set one cleaningsheet 17 irrespective of the number of the lead frames set in themolding die 28 upon molding and, as a result, the cost for the cleaningoperation can be decreased.

Further, since it is not required to use an expensive dummy lead framefor cleaning, by the use of the cleaning sheet 17 of this Embodiment 1,the cost of the cleaning operation for the molding die 28 can bedecreased.

Further, since the cleaning sheet 17 has the through holes 17 acorresponding to the openings 6 a of the cavities 6, and the sheetentirely covers the mating surfaces 26 of the molding die 28 uponcleaning, it does not lowers the operation efficiency of the cleaningand can improve the cleaning effect.

Further, in the production process for a semiconductor device such asthe QFP 19 in this Embodiment 1, since the time of the cleaningoperation for the molding die 28 can be shortened greatly and thecleaning effect for the molding die 28 can be improved, the productivityof the semiconductor device can be improved.

Embodiment 2

FIG. 7 is a plan view showing an example for a structure of a moldingdie cleaning sheet in Embodiment 2 according to this invention, FIG. 8is an enlarged fragmentary plan view showing an example of a state inwhich the molding die cleaning sheet shown in FIG. 7 is disposed at themating surface of the molding die and FIG. 9 is a plan view for thestructure of a molding die cleaning sheet as a modified example of themolding die cleaning sheet shown in FIG. 7.

In the Embodiment 2, description is to be made to a modified example ofthe molding die cleaning sheet used in the cleaning step of the moldingdie 28 shown in FIG. 2 in the semiconductor device manufacturing processexplained for the Embodiment 1.

The cleaning sheet (molding die cleaning sheet) 29 shown in FIG. 7 isformed with through holes 29 a at portions corresponding to the cavities6 of the molding die 28 like that the cleaning sheet 17 explained forthe Embodiment 1 and, in addition, formed with recesses such as slits 29b and flow cavity recesses 29 c to the corners at the outer periphery ofthe through holes 29 a.

The through hole 29 a has a size substantially identical with orslightly smaller than that of the cavity 6 of the molding die 28.

Further, the slit 29 b and the flow cavity recess 29 c are formed atportions corresponding to flow cavities 27 (recess) in communicationwith the cavity 6 of the second mold 4 as shown in FIG. 8. Among them,the flow cavity recess 29 c is a recess formed into substantially thesame shape as that of the flow cavity 27.

The flow cavity 27 is used for escaping air or encapsulating resin inthe cavity 6 into the flow cavity upon resin injection to avoidinclusion of air from the gate 13 or improve the filling balance of theencapsulating resin in the cavity 6.

Accordingly, the slits 29 b and the flow cavity recesses 29 c are usedfor completely filling the cleaning resin 25 shown in FIG. 5 to the flowcavity 27 which is a concaved portion communicating with the cavity 6and the air vent 14 upon cleaning of the molding die 28.

That is, when the cleaning resin 25 is injected into the cavity 6, thecleaning resin 25 is passed through the through hole 29 a of thecleaning sheet 29 into the cavity 6 and, further, the cleaning resin 25passes through the flow cavity recess 29 c and the slit 29 b at thecorners of the cavity 6 and flows into the flow cavity 27 and the airvent 14.

Thus, the cleaning resin 25 can be entangled to the cleaning sheet 29 byway of the flow cavity recess 29 c and the slit 29 b and, in this state,the cleaning resin 25 can be filled into the flow cavity 27 and the airvent 24.

As a result, the cleaning resin 25 after hardening thereof can beremoved from the second mold 4 simultaneously with detachment of thecleaning sheet 29 from the molding die 28.

As to whether the slit 29 b or the flow cavity recess 29 c is formed asthe recess, it is preferred to form the flow cavity recess 26 c insteadof the slit 29 b since the cleaning resin 25 less flows to the flowcavity 27 situated remote from the gate 13 of the second mold 4.

Further, since the cleaning resin 25 tends to flow easily into the flowcavity 27 on the side of the gate 13, the slit 29 b is formed in thecorresponding portion.

Accordingly, in the modified embodiment shown in FIG. 7 and FIG. 8(cleaning sheet 29 for QFP 19 shown in FIG. 6), the flow cavity recesses29 c is disposed only for the flow cavity 27 disposed at the place mostremote from the gate 13 and slit 29 b are formed for other threecorners.

On the other hand, the modified embodiment (cleaning sheet 29 for BGA(Ball Grid Array)) in FIG. 9 shows a case where slits 29 b are formed atfour corners. There is no particular restriction on the corner of thecavity 6 to which the flow cavity recess 29 c (refer to FIG. 7) or slit29 b is to be formed and there is also no particular restriction on thewidth and the length of the slit 29 b or the shape of the flow cavityrecess 29 c.

The material and the thickness of the cleaning sheet 29 in theEmbodiment 2 are identical with those for the cleaning sheet 27 of theEmbodiment 1.

Other structures for the cleaning sheet 29 in the Embodiment 2 and amanufacturing method for the semiconductor device using the cleaningsheet 29 are identical with those for the manufacturing method of thesemiconductor device using the cleaning sheet 17 explained for theEmbodiment 1 and, accordingly, duplicate explanations therefor areomitted.

According to the cleaning sheet 26 of the Embodiment 2 and themanufacturing method for the semiconductor device using the same, whenthe cleaning resin 25 is injected to the cavities 6 upon cleaning of themolding die 28 shown in FIG. 2, the cleaning resin 25 can be passedthrough the slits 29 b or the flow cavity recesses 29 c of the cleaningsheet 29.

Then, it is possible to fill the cleaning resin 25 to the concaveportions such as the flow cavity 27 or the air vent 14 and the cleaningresin 25 can be deposited being entangled to the cleaning sheet 29 byway of the recesses during cleaning.

Accordingly, since the cleaning resin 25 filled in the concave portions(flow cavity 27 and the air vent 14) of the mating surface 26 of thesecond mold 4 is removed by releasing the cleaning sheet 29 from thesecond mold 4 after hardening of the cleaning resin 25, the cleaningeffect for the concaved portions can be improved and the cleaning resin25 can be removed reliably together with the cleaning sheet 29 and,accordingly, the cleaning resin 25 can be removed easily from theconcaved portions.

As a result, the cleaning time for the molding die 28 by using thecleaning sheet 29 can be shortened.

Further, when each recessed portion such as the flow cavity recess 29 cor the slit 29 b corresponding to the concaved portion opposing to thegate 13 of the second mold 4 (portion relatively remote from the gate13) is made into a shape corresponding to the concaved portion, thecleaning effect for the concaved portion can be improved further.

Embodiment 3

FIG. 10 is a view showing an example for a structure of a molding diecleaning sheet in Embodiment 3 according this invention in which FIG.10A is a plan view, FIG. 10B is a cross sectional view taken along lineB-B in FIG. 10A and FIG. 11 is a plan view showing an example of a statein which the molding die cleaning sheet shown in FIG. 10 is disposed onthe mating surface of a molding die and FIG. 12 is an enlargedfragmentary cross sectional view taken along line C-C in FIG. 11.

In the Embodiment 3, explanation is to be made to a modified example ofa molding die cleaning sheet used in the cleaning step for the moldingdie 28 shown in FIG. 2 in the manufacturing process for thesemiconductor device as explained for the Embodiment 1 like that inEmbodiment 2.

That is, a cleaning sheet with frame (molding die cleaning sheet) 30shown in FIG. 10 comprises, like that the cleaning sheet 17 explainedfor the Embodiment 1, comprises a cleaning sheet 30 a which covers theentire mating surface 26 of the molding die 28 and in which throughholes 30 b are formed at positions corresponding to the cavities 6, anda frame-like reinforcing sheet 30 c which can be disposed along acircumferential periphery 26 a of the mating surface 26 to the outsideof plural cavities 6 in the mating surface 26 of the molding die 28.

The through hole 30 b formed in the cleaning sheet 30 a has a size aboutidentical with or slightly smaller than that of the cavity 6 of themolding die 28.

The cleaning sheet 30 with frame in the Embodiment 3 is used to increasethe clamping force at the outside of the cavity 6 upon clamping of themolding die 28 by the second mold 4 as a lower mold and the first mold 3as an upper mold upon injection of the cleaning resin 25 (refer to FIG.5) during cleaning for the molding die 28, as shown in FIG. 12, therebypreventing the cleaning resin 25 from leaking through the matingsurfaces 26 of the molding die 28.

That is, as shown in FIG. 10, the cleaning sheet 30 with frame is formedby appending the cleaning sheet 30 a formed with the through holes 30 bcorresponding to the cavities 6, and the frame-like reinforcing sheet 30c that can be disposed along the circumferential periphery 26 a of themating surface 26 to the outside of the plural cavities 6 of the matingsurface 26 of the second mold 4.

Thus, upon cleaning the molding die 28, as shown in FIG. 11, thecleaning sheet 30 a is disposed over the entire mating surface 26 withthe through holes 30 b of the cleaning sheet 30 a being corresponded tothe cavities 6, and the frame-like reinforcing sheet 30 c is disposed tothe mating surface 26 along the circumferential periphery 26 a of themating surface 26 to the outside of the plural cavities 6.

As shown in FIG. 10, in the cleaning sheet 30 with frame of theEmbodiment 3, the cleaning sheet 30 a and the reinforcing sheet 30 c arepreviously appended and, accordingly, the cleaning sheet 30 with frameis disposed on the mating surface 26 of the second mold 4 uponconducting cleaning.

Then, as shown in FIG. 12, the cleaning sheet 30 a and the reinforcingsheet 30 c are clamped by the first mold 3 and the second mold 4 and,further, the cleaning resin 25 is injected into the cavities 6 in theclamped state as shown in FIG. 5 to fill the cleaning resin 25 into thecavities 6 and, after hardening the cleaning resin 25, the cleaningresin 25 is removed together with the cleaning sheet 30 a from themating surfaces 26 of the molding die 28 to conduct cleaning for themolding die 28.

In a case where a semiconductor device having a relatively elongateencapsulation portion 22 (refer to FIG. 6: although QFP 19 shown in FIG.6 has a substantially square encapsulation portion 22) such as SOP orQFN using a matrix frame, when the distance between the outer end of thecavity 6 and the peripheral edge 26 a of the mating surface 26 (L shownin FIG. 11 and FIG. 12) is relatively short on the mating surface 26 ofthe molding die 28 (for example L: 10 mm or less), the cleaning resin 25leaked from the cavity 6 during cleaning for the molding die 28 maysometimes go beyond the molding die cleaning sheet and deposit on thelateral side in contiguous with the mating surface 26 of the molding die28. Accordingly, the cleaning sheet 30 with frame shown in FIG. 10 ismore effective to the cleaning for the molding die 28 for SOP or QFN inwhich L described above is 10 mm or less.

Preferably, the frame-like reinforcing sheet 30 c has a thickness ofabout 0.1 to 0.2 mm and is formed, for example, of non-woven fabric,paper, copper or fluoro resin.

The cleaning sheet 30 a and the reinforcing 30 c may be appendedpreviously to each other as in the cleaning sheet 30 with frame in theEmbodiment 3, or both of the sheets may be provided separately withoutappending and they may be disposed successively on the mating surface 26of the molding die 28 to conduct molding for cleaning.

Further, the cleaning sheet 30 with frame in the Embodiment 3 iseffective also to semiconductor devices using a matrix frame other thanSOP or QFN, or to BGA using a tape substrate.

The material and the thickness for the cleaning sheet 30 a in thecleaning sheet 30 with frame in the Embodiment 3 are identical withthose for the cleaning sheet 17 of the Embodiment 1.

Since the method of manufacturing the semiconductor device using thecleaning sheet 30 with frame in the Embodiment 3 is identical with themethod for manufacturing the semiconductor device using the cleaningsheet 17 explained for the Embodiment 1, duplicate explanation thereforare to be omitted.

According to the cleaning sheet 30 with frame in the Embodiment 3 andthe method of manufacturing the semiconductor device using the same, thecleaning sheet 30 with frame is disposed over the entire mating surface26 with the through holes 30 b of the cleaning sheet 30 a beingcorresponded to the cavities 6, and the reinforcing sheet 30 c isdisposed to the mating surface 26 along the circumferential periphery 26a of the mating surface 26 to the outside of the plural cavities 6, andthe cleaning sheet with frame is clamped between the first mold 3 andthe second mold 4 of the molding die 28 to contact cleaning.Accordingly, clamping force of the molding die 28 can be improved and,as a result, the cleaning resin 25 can be prevented from leaking fromthe mating surface 26 of the molding die 28 during cleaning.

Accordingly, since deposition of the cleaning resin 25 on the lateralside of the molding die 28 can be prevented, there are no troubles ofremoving the same and, as a result, the efficiency of the cleaningoperation for the molding die 28 can be improved.

Further, since the cleaning resin 25 can be prevented from leaking fromthe mating surface 26 of the molding die 28 during cleaning by the useof the cleaning sheet 30 with frame appended with the reinforcing sheet30 c, the cleaning resin 25 can be filled completely into the cavities 6and concaved portions such as flow cavity recesses 29 c (refer to FIG.8) and, as a result, the cleaning effect for the cavities 6 and theconcaved portions such as the cavity recesses 29 c can be improved.

The cleaning sheet 30 with frame having the reinforcing sheet 30 c isparticularly effective in a case where the distance between the outerend of the cavity 6 and the peripheral edge 26 a of the mating surface26 is relatively short in the molding die 28 (for example, 10 mm or lessof distance L shown in FIG. 11).

Further, since the cleaning resin 25 can be prevented from leaking fromthe mating surface of the molding die 28 during cleaning by the use ofthe cleaning sheet 30 with frame having the reinforcing sheet 30 c, thecleaning sheet 30 with frame can be attached to and detached from themating surface 26 of the molding die 28 easily.

Further, when the cleaning sheet 30 a is formed of a non-woven fabric,expansion and shrinkage of the cleaning sheet 30 a can be prevented byusing the reinforcing sheet 30 c and, as a result, the efficiency of thecleaning operation for the molding die 28 can be improved further.

Further, in a case where the resin is injected into the cavity 6 havingsmall gate 13 or air vent 14 in accordance with the size reduction ofthe package, the constitution of this embodiment described above iseffective for preventing lack of filling of the cleaning resin 25 intothe cavity 6 by the reason as will be described below.

It is necessary for the cleaning sheet 30 a that it has a thickness tosome extent and a flexibility to such an extent as not broken whenbending since it is necessary to have a strength so as not to be brokenupon removing the cleaning resin 25 after mold opening of the moldingdie 28.

However, when the cleaning sheet 30 a of such thickness and flexibilityis put in the molding die 28 having small gate 13 or air vent 14, thecleaning sheet 30 a may clog the gate 13 or air vent 14 to sometimeresult in lack of filling to the cavity 6.

Then, for overcoming such a problem, when a relatively thick part suchas a frame appended with the reinforcing sheet 30 c compared with thecleaning sheet 30 a disposed to a portion for the gate 13 and air vent14 is interposed between to mating surfaces of the molding die 28, as inthis embodiment, the pressure for clamping the cleaning sheet 30 a atthe portion for the gate 13 and air vent 14 can be lowered to preventclogging in the gate 13 and air vent 14.

Accordingly, lack of filling of the cleaning resin 25 to the cavity 6can be prevented. Further, the thick part interposed between the matingsurfaces 26 of the molding die 28 is not restricted to the constitutionof the reinforcing sheet 30 c appended to the cleaning sheet 30 adescribed above but it may be, for example, of a constitution beingformed separately from the cleaning sheet 30 a.

Embodiment 4

FIG. 13 is a perspective view showing an example for the structure of amolding die cleaning sheet in Embodiment 4 according to this invention,FIG. 14 is a view showing a constitution of a molding die cleaning sheetshown in FIG. 13 in which FIG. 14 A is a perspective view of areinforcing frame, FIG. 14B is a perspective of a cleaning sheet mainbody, FIG. 14C is an enlarged fragmentary plan view showing a portion Din FIG. 14B in an enlarged scale, FIG. 15 is an enlarge fragmentaryperspective view showing the structure of a cleaning sheet main body asa modified example to the molding die cleaning sheet shown in FIG. 13,FIG. 16 is a view showing a constitution of a molding die cleaning sheetas a modified example to the molding die cleaning sheet shown in FIG. 13in which FIG. 16A is an outer perspective view of a cleaning sheet mainbody, FIG. 16B is an outer perspective view of a reinforcing member andFIG. 16C is a fragmentary enlarged cross sectional view showing aportion E in FIG. 16B in an enlarged scale, FIG. 17 is a perspectiveview showing an example of a structure of a second mold to be cleaned bythe molding die cleaning sheet shown in FIG. 16 and FIG. 18 is a viewfor the result of showing an example of measured values for the surfacetemperature of an operator in the usual mold operation and the existentmolding die cleaning operation.

In the Embodiment 4, explanation is to be made to a molding die cleaningsheet in which the respective functions of the molding die cleaningsheets explained for Embodiments 1, 2 and 3 are combined and, inaddition, slits 31 g shown in FIG. 13 corresponding to the runners 8 andsecond through holes 31 f corresponding to the pots 9 of the molding die28 shown in FIG. 2 are disposed.

That is, a cleaning sheet with frame (molding die cleaning sheet 31)shown in FIG. 13, like the cleaning sheet 17 explained for theEmbodiment 1 comprises a cleaning sheet main body 31 a that covers theentire mating surface 26 of the molding die 28 when disposed between thefirst mold 3 and the second mold 4, and a frame-like reinforcing frame(reinforcing member) 31 b which can be disposed along the peripheraledge 26 a of the mating surface 26 to the outside of the plural cavities6 of the mating surface 26 of the molding die 28 (refer to FIG. 11).

As shown in FIG. 14B, the cleaning sheet main body 31 a is formed withfirst through holes 31 c at positions corresponding to the cavities 6 ofthe molding die 28, air vent slits (recesses) 31 d and flow cavityrecesses (recesses) 31 e corresponding to the air vents 14 at thecorners of the cavities 6, second through holes 31 f at positionscorresponding to the pots 9 of the molding die 28 and slits 31 g at thepositions corresponding to the runners 8 of the molding die 28.

On the other hand, as shown in FIG. 14A, the reinforcing frame 31 b isformed with an index portion 31 h as an extended portion at one of thefour corners for indicating the directionality and positioning recess 31i, as recesses to engage the positioning wedges 18 of the molding die 28for conducting positioning.

The index portion 31 h also has a gripping function for handling by anoperator and the operator can grip the index portion 31 h upon charginginto the molding die 28 or upon recovery from the molding die 28.

The reinforcing frame 31 b has a thickness, for example, of about 0.5 to0.6 mm and made of material such as thick paper, thermosetting resin ormetal.

Further, the cleaning sheet main body 31 a has a thickness, for example,of about 0.45 mm and is formed of a heat resistant and flexiblematerial, for example, 100% paper, cloth and non-woven fabric. Amongall, it is preferred to be formed of the non-woven fabric.

Further, the first through hole 31 c formed in the cleaning sheet mainbody 31 a has a size substantially identical with or slightly smallerthan that of the cavity 6 of the molding die 28.

In the same manner, the second through hole 31 a has a sizesubstantially equal with or slightly smaller than that of the pot 9 ofthe molding die 28.

Then, the cleaning sheet 31 with frame in the Embodiment 4, having thereinforcing frame 31 b, increases the clamping force at the outside ofthe cavity 6 upon clamping of the molding die 28 by the second mold 4 asa lower mold and the first mold 3 as the upper mold upon injection ofthe cleaning resin 25 (refer to FIG. 5) upon cleaning the molding die 28as shown in FIG. 12 to prevent the cleaning resin 25 from leaking fromthe mating surface 26 of the molding die 28.

The cleaning sheet main body 31 a and the reinforcing frame 31 b arejoined not by way of adhesives but preferably by embossing press bondingthat utilizes, for example, indent marks 33 such as a product number asshown in FIG. 13.

Thus, since the adhesive or the like is not used, cost for the cleaningsheet 31 with frame can be reduced.

Further, since the rigidity of the cleaning sheet main body 31 a can beincreased by the reinforcing frame 31 b to facilitate charging upondisposition to the molding die 28, the operation efficiency of thecleaning for the molding die can be improved.

Further, as in a cleaning sheet main body 31 a of a modified exampleshown in FIG. 15, a slit 31 g corresponding to a runner 8 may becorresponded only to a portion of the runner 8. That is, the slit 31 gis not formed above the runner 8 at the vicinity of the cavity 6 shownin FIG. 11 but a not slit part of the cleaning sheet main body 31 a isleft.

This can prevent that the cleaning sheet main body 31 a is disintegratedindividually.

Then, a modified example of the cleaning sheet 31 with frame is to beexplained.

FIGS. 16A, 16B and 16C show a cleaning sheet with frame (molding diecleaning sheet) 34 comprising a cleaning sheet main body 31 a and areinforcing frame (reinforcing member) 32 with grip 32 a.

The reinforcing frame 32 with grip of the cleaning sheet 34 with framecomprises a grip 32 a and a sheet support portions 32 c and the cleaningsheet main body 31 a and the reinforcing frame 32 with grip are joined,for example, as shown in FIG. 16C, by fitting protrusions 32 b formed tothe sheet support portion 32 c of the reinforcing frame 32 with grip andfitting holes 31 j formed in the cleaning sheet 31 a.

The cleaning sheet main body 31 a of the cleaning sheet 34 with frame isformed of wedge escape holes 31 k for escaping the positioning wedges 18or return pins 35 at the mating surface 26 of the second mold 4 shown inFIG. 17.

The functions of the cleaning sheet 34 with frame are identical withthose of the cleaning sheet 31 with frame shown in FIG. 13.

Then, when the cleaning is conducted for the molding die 28, thecleaning sheet main body 31 a is disposed over the entire mating surface26 while corresponding the first through holes 31 c of the cleaningsheet main body 31 a to the cavities 6, the air bent slits 31 d or flowcavity recesses 31 e to the air vents 14, the slits 31 g to a portion ofthe runners 8 and the second through holes 31 f to the pots 9respectively (of the cleaning sheet main body 31 a).

Subsequently, the cleaning sheet main body 31 a and the reinforcingframe 31 b or the reinforcing frame 32 with grip are clamped between thefirst mold 3 and the second mold 4 and, further, the cleaning resin 25is injected into the cavity 6 in this clamped state to fill the cavities6 with the cleaning resin 25 as shown in FIG. 5.

In this case, the cleaning resin is supplied by way of the runners 8 tothe cavities 6 and the cleaning resin 25 is passed through the secondthrough holes 31 f, the slits 31 g and the first through holes 31 c ofthe cleaning sheet main body 31 a into the cavities 6.

Subsequently, the cleaning resin 25 is hardened and the cleaning resin25 is removed together with the cleaning sheet main body 31 a from themating surface 26 of the molding die 28 to conduct cleaning for themolding die 28.

Location of the cleaning sheet 31, 34 with frame to the molding die 28and taking out of the sheet from the molding die 28 may be conducted byoperator's manual operation, or by an automatic apparatus using a loaderand an unloader. In the case of using the automatic apparatus, thereinforcing frame 31 b or the reinforcing frame 32 with grip may besaved.

Further, by changing the thickness of the reinforcing frame 31 b or thereinforcing frame 32 with grip in the cleaning sheet with frame 31, 34,the amount of leakage of the resin (cleaning resin 25) in the matingsurface 26 at the periphery of the openings of the cavities 26 of themolding die 28 can be adjusted.

Further, there are no particular restrictions on the width, length andshape of the recess in the slit 31 g corresponding to the runner 8, airvent sheet 31 d corresponding to the air vent 14 and the flow cavityrecess 31 e.

In the Embodiment 4, since the second through holes 31 f of the cleaningsheet main body 31 a are disposed corresponding to the pots of themolding die 26, flow of the cleaning resin 25 in the culls and the pots9 of the molding die 28 can be made smooth, when conducting cleaning forthe molding die 28 using the cleaning sheet with frame 31, 34.

Particularly, resistance to the flow at the initial stage of injectingthe cleaning resin 25 can be eliminated.

Accordingly, since the cleaning resin can be filled completely in theculls 7 upon cleaning the molding die 28, obstacles on the matingsurface 26 at the periphery of the pots 9 or the culls 7 can be removedreliably.

Further, since the cleaning sheet main body 31 a is provided with theslits 31 corresponding to the runners 8 and the first through holes 31 ccorresponding to the cavities 6, the air vent slits 31 d and the flowcavity recesses 31 e corresponding to the air vents 14 flow of thecleaning resin 25 at each of the portions is not hindered but madesmooth, so that the cleaning resin 25 can be filled reliably by way ofthe runners into the cavities 6 and the air vents 14, and obstacles inthe runner 8 cavity 6 and the air vent 14 can be removed reliably.

As a result, the cleaning effect for the molding die 28 can be improved.

Further, FIG. 18 shows the result of measurement for the surfacetemperature of an operator's body in usual molding operation andcleaning operation. It can be seen that while the temperature is 35.0°C. during usual mold operation, the temperature is higher by about 3 to5° C. than 35.0° C. substantially for the entire period during cleaningoperation (measurement No. 2-8).

Accordingly, in a case where the cleaning sheet 31, 34 with frame of theEmbodiment 4 is used, since the operation of removing mold burrs (mainlyin culls 7 or air vents 14) is not required, this extremely shorten theaccess period of the operator to a heat source (mold).

As a result, the cleaning operation for the molding die 28 conducted byan operator can be mitigated greatly and the operation environment canbe enhanced greatly.

The invention made by the present inventors has been explainedspecifically with reference to the embodiments of the invention but thisinvention is not restricted only to the embodiments of the inventiondescribed previously and it will be apparent that various modificationsare possible within a range not departing the gist of the invention.

For example, while the Embodiments 1, 2, 3 and 4 have been explained tothe case where the cleaning sheet 17, 29 or 30 a and the cleaning sheetmain body 31 a are formed of the non-woven fabric, a material for thecleaning sheet 17, 29 or 30 a and the cleaning sheet main body 31 a isnot restricted only to the non-woven fabric but paper or other cloth mayalso be used.

Also, the thickness for the cleaning sheet 17, 29, 30 a and the cleaningsheet main body 31 a is not restricted only to those explained for theEmbodiments 1, 2, 3 and 4 but those of various thickness may be used.

Further, the size of the cleaning sheet 17, 29 or 30 a and the cleaningsheet main body 31 a may also be somewhat smaller than that of themating surface 26 so long as the sheet has a size covering the matingsurface 26 of the molding die 28 substantially entirely.

Further, the shape and the number of the through holes 17 a, 29 a, 30 bor first through hole 31 c, the second through hole 31 f formed to thecleaning sheet 17, 29 or 30 a and the cleaning sheet main body 31 a arenot restricted to those of the Embodiments 1, 2, 3 and 4 but variousshapes or numbers of them may be used. Further, also with respect to thesize, it may suffice that the size is substantially identical with theopening 6 a of the cavity 6 or the pot 9, or the size may be of such anextent as capable of passing the cleaning resin 25 therethrough.

The molding die 28 for the Embodiments 1, 2, 3 and 4 may be of a seriesin one row of lead frames, or a matrix frame and the cost for thecleaning operation can be reduced in any of the cases.

Further, the Embodiments 1 and 2 have been explained to a case where thesemiconductor device molded by the transfer molding apparatus shown inFIG. 1 is the QFP 19 shown in FIG. 6. However, the semiconductor deviceis not restricted only to the QFP 19 but the invention may be applied toSOP or like other semiconductor device so long as the semiconductordevice is molded as and assembled in the transfer molding apparatus.

Further, while the molding die 28 in the Embodiments 1, 2, 3 and 4 hasbeen described as having a first mold 3 as an upper mold and the secondmold 4 as a lower mold but on the contrary, the first mold 3 may be alower mold while the second mold 4 may be an upper mold.

The effect obtained by typical inventions among those disclosed in thepresent application are to be explained briefly as below.

Since through holes corresponding to the cavities, through holescorresponding to the pots or slits corresponding to the runners areformed in the molding die cleaning sheet, the cleaning resin can beprevailed throughout the cavities to improve the cleaning effect for themolding die.

1. A method of manufacturing a semiconductor device by using a cleaningsheet for cleaning a molding die, comprising the steps of: (a) providingthe molding die having a first mold, and a second mold opposing to thefirst mold, wherein the second mold has pots and cavities arranged nextto the pots, wherein the first mold has a first main surface, whereinthe second mold has a second main surface opposing to the first mainsurface, and wherein the cavities are formed on the second main surfaceof the second mold; (b) providing the cleaning sheet having an opening;(c) disposing cleaning resin into the pots, respectively; (d) disposingthe cleaning sheet between the first mold and the second mold such thatthe cavities are arranged inside of the opening of the cleaning sheet ina plan view; (e) clamping the cleaning sheet with the first main surfaceof the first mold and the second main surface of the second mold; (f)supplying the cleaning resin into the cavities from the pots by way ofthe opening of the cleaning sheet; (g) hardening the cleaning resin; (h)releasing the cleaning sheet from between the first mold and the secondmold, wherein the hardened cleaning resin is attached to the cleaningsheet; (i) disposing encapsulating resin into the pots; (j) disposingsemiconductor chips in the cavities, respectively; and (k) supplying theencapsulating resin into the cavities from the pots.
 2. The method ofmanufacturing the semiconductor device according to claim 1, wherein thecleaning sheet is comprised of paper which is not capable of beingimpregnated or permeated with the cleaning resin.
 3. The method ofmanufacturing the semiconductor device according to claim 2, whereinbefore the step (j), the semiconductor chips are mounting over a leadframe having a plurality of leads, and are electrically connected withthe plurality of leads with wires.
 4. The method of manufacturing thesemiconductor device according to claim 1, wherein before the step (j),the semiconductor chips are mounting over a lead frame having aplurality of leads, and are electrically connected with the plurality ofleads with wires.
 5. The method of manufacturing the semiconductordevice according to claim 1, wherein in the step (e), the cleaning sheetis clamped with a peripheral portion of the first main surface of thefirst mold and a peripheral portion of the second main surface of thesecond mold.
 6. The method of manufacturing the semiconductor deviceaccording to claim 1, wherein the cleaning sheet is comprised of fabricwhich is capable of being impregnated or permeated with the cleaningresin.
 7. A method of manufacturing a semiconductor device by using acleaning sheet for cleaning a molding die, comprising the steps of: (a)providing the molding die having a first mold, and a second moldopposing to the first mold, wherein the first mold has first cavities,wherein the second mold has pots and second cavities arranged next tothe pots, wherein the second cavities oppose the first cavities,respectively, wherein the first mold has a first main surface, whereinthe second mold has a second main surface opposing to the first mainsurface, wherein the first cavities are formed on the first main surfaceof the first mold, and wherein the second cavities are formed on thesecond main surface of the second mold; (b) providing the cleaning sheethaving an opening; (c) disposing cleaning resin into the pots,respectively; (d) disposing the cleaning sheet between the first moldand the second mold such that the first and second cavities are arrangedinside of the opening of the cleaning sheet in a plan view; (e) clampingthe cleaning sheet with the first main surface of the first mold and thesecond main surface of the second mold; (f) supplying the cleaning resininto the first and second cavities from the pots by way of the openingof the cleaning sheet; (g) hardening the cleaning resin; (h) releasingthe cleaning sheet from between the first mold and the second mold,wherein the hardened cleaning resin is attached to the cleaning sheet;(i) disposing encapsulating resin into the pots; (j) disposingsemiconductor chips in the cavities, respectively; and (k) supplying theencapsulating resin into the first and second cavities from the pots. 8.The method of manufacturing the semiconductor device according to claim7, wherein the cleaning sheet is comprised of paper which is not capableof being impregnated or permeated with the cleaning resin.
 9. The methodof manufacturing the semiconductor device according to claim 8, whereinbefore the step (j), the semiconductor chips are mounting over a leadframe having a plurality of leads, and are electrically connected withthe plurality of leads by way of wires.
 10. The method of manufacturingthe semiconductor device according to claim 7, wherein before the step(j), the semiconductor chips are mounting over a lead frame having aplurality of leads, and are electrically connected with the plurality ofleads by way of wires.
 11. The method of manufacturing the semiconductordevice according to claim 7, wherein in the step (e), the cleaning sheetis clamped with a peripheral portion of the first main surface of thefirst mold and a peripheral portion of the second main surface of thesecond mold.
 12. The method of manufacturing the semiconductor deviceaccording to claim 7, wherein the cleaning sheet is comprised of fabricwhich is capable of being impregnated or permeated with the cleaningresin.